DOI: https://doi.org/10.30970/vph.60.2023.157
Electrophysical properties of the Cu–Pb subsystem of Bi–Cu–Ga–In–Sn–Pb high-entropy alloys
V. Poverzhuk, Yu. Plevachuk, L. Romaka
| Visnyk of the Lviv University. Series Physics
60 (2023) ñ. 157-165
DOI: https://doi.org/10.30970/vph.60.2023.157 Electrophysical properties of the Cu–Pb subsystem of Bi–Cu–Ga–In–Sn–Pb high-entropy alloysV. Poverzhuk, Yu. Plevachuk, L. Romaka | |
The main problems of research on multicimponent high-entropy alloys (HEA) are related to the high melting temperatures of their constituent elements. Therefore, it is useful to study similar multicomponent alloys conisisting of elements with lower melting points, as well as their subsystems with a smaller number of components. According to the concept of multicomponent HEA, high entropy of mixing can stabilize the formation of solid solutions (simple bcc or fcc crystal structure) during solidification. Stabilization of the solid solution and prevention of the intermetallic phases during solidification is provided by the high entropy of mixing in the solid and liquid states. HEA have increased strength, high hardness, thermal stability in combination with good resistance to oxidation and corrosion. These properties allow to significantly expand the scope of these alloys, which have recently begun to be intensively researched as reflow temperature solders. In this work, the electrical resistivity and thermoelectric power of the binary Cu–Pb alloys, which is a subsystem component of the low-temperature HEA Bi–Cu–Ga–In–Pb–Sn, have been studied in a wide temperature range including solid and liquid states.